United Microelectronics Corporation

NYSE•UMC

CEO: Mr. Jia Cong Hung

セクター: Technology

業種: Semiconductors

上場日: 2000-09-19

United Microelectronics Corporation operates as a semiconductor wafer foundry in Taiwan, China, Hong Kong, Japan, Korea, the United States, Europe, and internationally. The company provides circuit design, mask tooling, wafer fabrication, and assembly and testing services. It serves fabless design companies and integrated device manufacturers. United Microelectronics Corporation was incorporated in 1980 and is headquartered in Hsinchu City, Taiwan.

連絡先情報

Hsinchu Science Park, No. 3 Li-Hsin 2nd Road, Hsinchu City, 300094, Taiwan

886-3-578-2258

www.umc.com

時価総額

$23.32B

PER (TTM)

17.8

35.9

配当利回り

4.8%

52週高値

$12.68

52週安値

$5.71

52週レンジ

52%

順位21Top 7.6%

6.0

F-Score

改良版 Piotroski 分析

10年ファンダメンタル

強い • 6 / 9 ポイント

スコアレンジ (0-9)

8-9: 価値が優れている

6-7: 基礎体質が強い

4-5: 全体的に堅調

0-3: パフォーマンスが弱い

データ期間: 2016-2025

財務ダッシュボード

Q4 2025 データ

売上高

$1.99B+2.36%

直近4四半期の推移

EPS

$0.13+19.12%

直近4四半期の推移

フリーCF

$582.07M+30.58%

直近4四半期の推移

2024 Annual 決算ハイライト

主なハイライト

Revenue Increased Despite Price Drop Operating revenues reached US$7.08B, up 4.4%, partially offset by a 5.0% decline in average selling price.

Net Income Declined 18.3% Net income attributable to parent decreased 18.3% to US$1.49B in 2024, reflecting margin compression.

Increased R&D Investment R&D expenses rose 17.6% to US$476M, increasing R&D spend ratio to 6.7% of operating revenues.

Intel 12nm Collaboration Progress Joint 12nm semiconductor process platform development with Intel is progressing, targeting production commencement in 2027.

リスク要因

Industry Cyclicality and Overcapacity Semiconductor industry downturn resulted in lower utilization rates, averaging 68.7% for the fiscal year 2024.

Customer Concentration Risk Top ten customers accounted for 55.6% of 2024 operating revenues, exposing the company to significant concentration risk.

Geopolitical Trade Tensions Rising political conflicts between US and China, including tariff escalations, may adversely impact global business environment.

Technology Adoption Delays Inability to rapidly adopt new process technologies competitively risks losing customers and eroding profit margins.

見通し

Singapore Fab Expansion Timeline Greenfield 28nm/22nm fab in Singapore is expected to commence production ramp in January 2026.

Focus on Customer-Driven Foundry Strategy emphasizes operating as a customer-driven foundry, leveraging advanced process technologies and IP portfolio.

Renewable Energy Transition Secured 30-year CPPA for offshore wind power, supporting the goal of 100% renewable energy use by 2050.

Capital Expenditure Planning Future capital expansion plans will focus on 12-inch wafer facilities to maintain technology leadership and scale.

同業比較

売上高 (TTM)

CDW

$22.42B

+6.8%

GIB

$11.60B

+9.0%

UMC

$7.65B

+2.3%

粗利益率 (最新四半期)

CHKP

85.1%

-2.1pp

FFIV

81.5%

-0.1pp

TRMB

72.0%

+0.2pp

主要指標

銘柄コード	時価総額	PER (TTM)	ROE (TTM)	負債比率
TER	$44.87B	80.9	19.9%	8.3%
UMC	$23.32B	17.8	11.4%	13.5%
ON	$23.21B	191.1	1.5%	27.7%

長期トレンド

直近4四半期

売上高

純利益

営業キャッシュフロー

4四半期売上高CAGR

4.2%

緩やかな成長

4四半期純利益CAGR

11.0%

収益性の着実な向上

キャッシュフロー安定性

100%

優れたキャッシュフローの実績

深度リサーチ

次回決算:2026年4月21日

EPS:-

売上高:-

財務データ

決算説明会

財務レポート

ニュース

損益計算書

バランスシート

キャッシュフロー計算書

財務比率

変化率

損益計算書	直近12ヶ月

データなし